Nvidia has been working on a prototype multi-die AI accelerator chip called RC 18. The 36-module strong chip, developed by Nvidia Research, is currently being evaluated in the labs, and its highly ...
In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies as simply analogous to the interconnect between functional blocks on a single ...
SUNNYVALE, Calif., Sept. 25, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
AUSTIN, Texas – July 9, 2007 – Staktek Holdings, Inc. [NASDAQ: STAK], a market-leading provider of intellectual property and services for next-generation module technologies, today announced a new ...
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