How close in performance and integration are FPGAs and ASICs? Advances in FPGA architectures and the use of 90-nm process rules have allowed the latest generation of FPGAs to achieve levels of ...
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
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